Engineers are looking for competitive thermal management solutions that can remove the heat from increasingly sensitive electronic components. Thermal greases are often considered, but due to concerns about ‘bleed-out’ and longterm reliability, engineers may end up selecting more expensive options. Momentive Performance Materials has recently introduced SilCool TIG 210
BX, a thermally-conductive grease that provides ‘low bleed’ and low thermal resistance for applications where thin bond lines are required. In addition to thermal conductivity (2.1W/mK), this material offers stable performance, which is typically required for automotive applications, such as an engine control unit.
SilCool TIG 210 BX also offers excellent processability, enabling thinner bond lines that allow for minimum thermal resistance. With these attributes, this is an excellent product to consider for many challenging automotive electronics applications.