Master Bond MB514 polyethylene adhesive addresses the bonding challenges presented by non-polar and low-energy polyolefi n surfaces.
Typically, a pre-treatment stage, which may include fl ame treatment, etching or roughening, is required before being able to bond polyolefi n substrates. Specially formulated to eliminate this time-consuming operation, the MB514 polyolefi n-based hot melt is particularly suited for use on untreated surfaces of polyethylene, polypropylene and combinations of these substrates.
Processing requires the melting of these compositions and then applying the molten hot melt to the surfaces to be bonded. Excellent bond performance is retained over a temperature range of -29°C to 88°C (-20°F to 190°F). MB514 adhesive is VOC-free, being comprised of 100% solids with no solvents. Bond strengths develop rapidly with no need for clamps or post cure during assembly. One of the main advantages of this polyethylene adhesive is the rapid speed of cure, which makes it ideal for high-speed assembly operations as the bonds are formed immediately upon cooling.