GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, has released two new modules for its popular PACSystems RX3i that reduce downtime, provide high resolution for improved process control and high performance sampling of data to improve throughput. The new isolated Thermocouple analogue input modules and isolated Resistive Temperature Device (RTD) module deliver channel-to-channel isolation for performance and hot swap capability to reduce downtime. Karl Pickan, Product Manager OEM for GE Fanuc Intelligent Platforms Europe said, “Everyone is looking to gain higher productivity with their existing equipment so they can boost revenue without boosting expenses. Three of the most important factors in looking at productivity are throughput, yield and downtime. These new modules do a lot to improve each of these areas. “The high performance sampling of data will give better throughput as it quickly processes the critical sample information. The high resolution (11.5-16 bits) of data gives better process control. Our data accuracy is much better with higher resolution, and that directly contributes to yield as you control those processes. “The fi nal step in productivity is downtime, and the new advanced diagnostics in these modules help to get your faults cleared quickly and the process back up and running so that you can be more productive.” These new modules provide increased performance and advanced diagnostics taking advantage of the high performance RX3i PCI bus. -