ansys graphics cardAnsys claims its AIM 17.2 can accelerate product design through upfront simulation with this new version offering enhanced engineering simulation for thermal management.

The new version of AIM builds upon its existing, combined fluid thermal and solid thermal-stress capabilities with momentum and heat sources now available for fluid and conjugate heat transfer analysis, enabling simulations to include such features as electronic package power sources, fans and filters. Heat loads from a magnetostatic solution can also be applied, claims the company.

Additionally AIM 17.2 provides new options for optimising bolted connections that allow engineers to correctly model loading and bolt tightening sequences for structural assemblies.