Molex says its SpeedStack mezzanine connector system, is a high-density, low-profile solution that supports data rates of up to 40Gbps per differential pair. The company claims the system is suitable for OEMs that contend with limited PCB real estate. The connector system comes in multiple circuit sizes of 22, 44, 60, 82, 104 and 120 with a range of 6 – 32 differential pairs for flexibility. The insert-moulded wafer design includes a protective shrouded housing, providing support to the terminal location and improved electrical balance.