Thermal management

Bergquist TGF 10000 delivers a new benchmark in high-performance thermal gap fillers

Published Modified
3 min
Bergquist TGF 10000 application on ADAS domain controller.

Thermal management in high-energy data components is essential for the vehicles of tomorrow. Michael H-Cai, Business Development Manager at Henkel Adhesives Technologies explains how its new Bergquist Thermal Gap Filler TGF 10000 solves this vital challenge.

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This article was produced by AMS in partnership with Henkel

The automotive industry continues to undergo a significant transformation, one where vehicles are no longer defined merely by mechanical performance, but as sophisticated computing platforms and mobile data centres, processing enormous amounts of information in real time. 

Connectivity and infotainment are becoming central to the driving experience, while electrification and Advanced Driver Assistance Systems (ADAS) are creating the platform for the autonomous cars of tomorrow. ADAS sensors, high-performance processors and requirements for ever more compact designs, means the demand for reliable thermal management materials has never been greater. Managing heat safely, reliably and efficiently has become a critical engineering challenge in meeting the needs of tomorrow’s electronics.

To meet this challenge, OEMs and suppliers need thermal interface materials that combine exceptional thermal conductivity with excellent reliability, ease of manufacturing, guaranteed performance and critically, optimal data transmission, even in the most severe of automotive environments. 

The solution can now be found in Henkel Adhesive Technologies’ new Bergquist TGF 10000 silicon-based thermal gap filler. This advanced material is purpose-engineered to address the emerging thermal and reliability challenges. By delivering superior thermal dissipation, high dispensing efficiency, optimal gap stability and long-term performance, it is the ultimate product for high-power System-on-Chip (SoC) modules in domain controllers and car computers. 

Managing heat concentration for maximum data transmission

Traditional materials can lack the ability to dissipate heat at the speed required, resulting in thermal throttling, degraded performance, reduced component lifespan or even system failure. Bergquist TGF 10000 addresses these challenges with 10W/m-K thermal conductivity, enabling efficient heat dissipation for high computing power SoCs, especially those used in ADAS modules. Its ability to pull heat away from SoCs, controllers and power modules, enables higher computing performance without throttling, as well as optimised thermal pathways in compact assemblies. In addition, it provides long-term protection for sensitive electronics and greater design flexibility for the next generation of control units across the automotive industry, as well as in consumer electronics, power conversion systems and telecoms hardware. 

Heat, moisture, vibration and thermal cycling are all stress factors in automotive environments. Bergquist TGF 10000 has been engineered to excel in all these areas, including less than 20 percent thermal impedance increase after accelerated ageing conditions testing, demonstrating long-term consistency in thermal performance. 

It also demonstrates proven stability under 85°C/85% relative humidity conditions, ensuring performance even in high-humidity environments. As well as 150°C heat ageing resistance, it has been engineered for remarkable survivability during repeated -40°C to 150°C thermal shock, while its gap stability is maintained even in vertical orientations under continuous vibration. These are all vital product attributes that meet modern challenges and enable reliable, compact components such as the ADAS domain controller, cockpit domain controller, car computer and power conversion module, all of which are essential to support safer and smarter vehicles.

Optimised for efficiency, sustainability and safety

The evolving complexity of vehicles and assembly means manufacturers need thermal materials that integrate effortlessly into their processes. Downtime caused by clogging, inconsistent flow or difficult mixing ratios can quickly impact on production lines and add unexpected costs. 

Bergquist TGF 10000 is engineered with optimised rheology and precisely controlled filler size to ensure a smoother dispensing process with no equipment blocking. Its ability to deliver high-speed dispensing maximises production efficiency, while its smooth, consistent flow ensures uniform results that are always predictable.

 

This advanced silicone material eliminates the frustrations associated with air gaps, degraded thermal performance or uneven heat dissipation due to poor wetting. It delivers excellent wetting to substrates properties, even after long-term usage and exposure to harsh environmental conditions. This inherent ability to maintain secure contact ensures low thermal impedance, consistent thermal performance, better protection against heat cycling and reduced long-term reliability concerns. These qualities are essential to maintaining tight thermal tolerances and maximising cooling efficiency throughout a component’s lifespan. 

For applications requiring stringent safety certifications, the material is engineered with UL94 V-0 flame retardant properties that limits flame propagation and can self-extinguish quickly, all of which is vital for supporting safety-critical designs. When it comes to meeting sustainability targets, the reduced D4 to D10 content of Bergquist TGF 10000 also ensures compliance, as well as minimising outgassing.

Engineered for the vehicles of today and tomorrow

As automotive electronics continue to advance, engineers will continue to face thermal challenges. The rapid evolution of Artificial Intelligence (AI) in vehicles means systems will need to become more powerful, architectures and platforms more complex and requirements for reliability even more demanding. In order to keep pace with this evolution, materials must also rise to the challenge, delivering not just high thermal conductivity, but also ease of production, safety and longevity. 

With its 10W/m-K thermal performance, exceptional proven reliability, high dispense rate, excellent wetting to substrates properties and stability under harsh conditions, Bergquist TGF 10000 sets a new standard for automotive thermal management. More than simply a material, it is a performance and practicality solution for OEMs and suppliers that can empower the future of electronics and automotive innovation.

Read more about Henkel here.