Automotive Wire Harness & EDS Conference Returns to Detroit in 2025

The Automotive Wire Harness & EDS Conference will return to the Detroit area this October, offering two full days of focused discussion, technical insight, and peer collaboration on the future of automotive electrical and electronic distribution systems. 

Now in its fourth year, the event has established itself as the leading platform in North America for engineers, decision-makers, and innovators working in wiring systems, harness architecture, and electrical distribution within the automotive industry. 

What to Expect in 2025 

The 2025 edition will bring together stakeholders from across the supply chain to address some of the most pressing challenges and opportunities in automotive EDS and harness design, including: 

• Advancements in 48V and high-voltage systems 

• Trends in zonal and modular E/E architecture 

• Strategies for harness weight reduction and sustainable materials 

• Manufacturing process automation and digital continuity 

• Standards development, validation, and compliance 

• Integration of high-speed data, fiber optics, and software-defined architecture 

• Practical case studies from OEMs and suppliers navigating electrification, ADAS, and complexity management 

Guided by Industry Experts 

This year’s agenda is shaped by a knowledgeable and experienced Advisory Board drawn from leading OEMs and Tier 1s: 

• Senad Melkic, GG Group 

• Aaron de Chazal, TE Connectivity 

• Vijy Koshy, Molex 

• Leena Shah, Ford Motor Company 

• Peter Van Wordragen, Leoni Wiring Systems 

• Eric Varton, Yazaki North America 

• Brian Haase, General Motors 

• Dr. Rainer König, formerly Mercedes-Benz 

Their input ensures the conference addresses practical engineering concerns, regulatory pressures, and the fast-evolving technology landscape. 

Who Attends 

Over the past three years, the conference has welcomed participants from across the automotive ecosystem, including: 

• Major OEMs: Ford, GM, Stellantis, Toyota, Honda, Tesla, Rivian, Volkswagen, Mercedes-Benz, BMW 

• Tier 1s and suppliers: Yazaki, Aptiv, TE Connectivity, Molex, Leoni, Lear, Schunk 

• Tooling, validation, and software providers 

• Engineers, program leads, procurement professionals, and system architects 

Previous attendees consistently cite the event’s technical depth, supplier diversity, and networking opportunities as key takeaways. 

Why Attend? 

• Focused Content: Tailored sessions on EDS and harness-specific challenges — not buried in broader E/E topics 

• Peer Exchange: In-person networking with others facing similar design, sourcing, and manufacturing challenges 

• Real-World Case Studies: Presentations from OEM and Tier 1 teams actively delivering next-gen vehicle platforms 

• Technology Showcase: See the latest tools, connectors, materials, and software from industry-leading suppliers 

• Location: Hosted in Dearborn, just minutes from major OEM campuses and engineering centers 

Registration Now Open

Full program details, speaker announcements coming soon

Early bird discount registration options are available here

Space is limited, and early registration is recommended for access to workshops and networking events.